New Electronics

Leti and CMP provide multi-project wafer service with integrated silicon oxram

Leti, a research institute at CEA Tech, and Circuits Multi-Projects (CMP)are offering the world's first multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on ...
Electronic Design

Leti and CMP announce multiproject wafer service with integrated silicon OxRAM

Grenoble, France. Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the industry’s first ...
Yahoo Finance

Axus Technology Delivers Industry’s Lowest Cost of Ownership for CMP Processes on 200mm SiC Wafers

Capstone CS200 CMP systems from Axus Technology enable customers to realize per-wafer CoO savings of more than 50% for CMP processes on 200mm SiC wafers, compared to the closest competitor. · ...
PR Newswire

CMP Pads Market Size to Grow USD 1412.2 Million by 2029 at a CAGR of 7.7 | Valuates Reports

BANGALORE, India, Jan. 8, 2024 /PRNewswire/ -- CMP Pads Market is Segmented by Application (300mm Wafer, 200mm Wafer), by Type (Hard Pad, Soft Pad). The Global CMP Pads Market Size is expected to ...
Nasdaq

New Applied Materials Technologies Help Leading Silicon Carbide Chipmakers Accelerate the Transition to 200mm Wafers and Increase Chip Performance and Power Efficiency

Key to the world’s best electric vehicle power trains, silicon carbide chips are transitioning to larger, 200mm wafers which boost output to meet growing global demand Applied’s new 200mm CMP system ...