Rama Puligadda, CTO at Brewer Science, sat down with Semiconductor Engineering to talk about a broad set of changes in semiconductor manufacturing, packaging, and materials, and how that will affect ...

The well-established success of computational engineering in various disciplines has fostered a rapid adaptation of computation-based methods to materials development in the commercial sector in ...

Scientists have long desired to create artificial systems that function with the precision and efficiency of biological systems. Researchers are now uncovering principles that could allow the creation ...

Materials are a necessity for all engineering applications. Materials science and engineering seeks to understand the fundamental physical origins of material behavior in order to optimize properties ...

Johns Hopkins researchers have discovered new materials and a new process that could advance the ever-escalating quest to make smaller, faster, and affordable microchips used across modern electronics ...

WEST LAFAYETTE, Ind. — Additive manufacturing — commonly known as 3D printing — has become a staple area of study across engineering disciplines because of its potential to revolutionize the design ...

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and ...

Researchers have demonstrated a new technique that allows "self-driving laboratories" to collect at least 10 times more data than previous techniques at record speed. The advance—which is published in ...

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing ...

BILLERICA, Mass.--(BUSINESS WIRE)--Entegris, Inc. (Nasdaq: ENTG), a leading supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, announced ...