The project seeks to repurpose by-products such as wheat straw and sugarcane residue into paper mailers.

LAS VEGAS, NV, UNITED STATES, January 20, 2026 / EINPresswire.com / — CIT (CEO Seung Jeong) announced its participation in ...

Investments in automation and additional tools for data analytics keep coming to packaging lines as plants become more connected. Machine learning and digital twin technology are increasing throughput ...

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as ...

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology Over the years, IBM has accumulated R&D and manufacturing technologies for ...

European tech company Fresh Inset introduces its Vidre+ Complex application in the US, which is designed to extend produce freshness, quality, appearance and nutrient value, without disrupting brands’ ...

Revolutionary film technology from Envalior and PerfoTec extends fresh produce shelf life fourfold using natural atmosphere control ...

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

CINCINNATI--(BUSINESS WIRE)--ProAmpac, a leader in flexible packaging and material science, announces the launch of ProActive Intelligence Moisture Protect (MP-1000), a patent-pending breakthrough ...

Amazon India has partnered with IIT Roorkee to develop recyclable and compostable packaging made from agricultural waste. The ...

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).