Intergraph announced today that Paulin Research Group has released FEATools™, a software tool for finite element analysis that links with CAESAR II to analyze components outside of code limits and ...

Theory of elasticity: elastic stability, principal of minimum potential energy, Raylegh-Ritz methods. Introduction to finite element methods of stress analysis: computer implementation and use of ...

Intergraph Releases CAESAR II 2011 R1 for advanced integration with Smart 3D & SmartPlant Review for data transfer from piping design to the engineering environment. Intergraph has released an ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

The rise of 3D integrated circuits (ICs) and heterogeneous packaging is reshaping how automotive ICs fulfill demanding analog and sensor requirements. Whether for ...

When certain polymeric materials with birefringence capabilities are heated above the glass transition temperature and loaded, then slowly cooled to normal room temperature, the stresses induced by ...

The spatial analysis of horizontal stress orientation is important to study stress sources and understand tectonics and the deformation of the lithosphere. Additional to the stress sources, the ...