SAN MATEO, Calif. ” Ziptronix, a startup spun from the Research Triangle Institute (Research Triangle Park, N.C.) will introduce a new “engineered substrate” material Tuesday (Sept. 9) for use in ...

Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) Kicking off this ...

Innovative materials are critical for maintaining integrity during advanced semiconductor manufacturing processes. Temporary bonding is being enabled by these new materials and is making a name for ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics.

“Our 200-mm EVG850LT system has been instrumental in helping us fulfill customer requirements for high-performance SOI wafers,” stated Prof. He ZhiQiang, CEO of SST. “As we look to advance our ability ...

New Monolithic Lens Molding (MLM) capability enables up to eight-megapixel-and-higher-resolution devices. CHIBA, Japan, Dec. 1, 2010 /PRNewswire/ -- SEMICON JAPAN -- EV Group (EVG), a leading supplier ...

Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such as Co-Packaged Optics, including ...

Even though fifth-generation (5G) wireless technology has yet to fully take root around the world as the standard for mobile communications, researchers are already envisioning 6G wireless. This next ...

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...