Packaging equipment can be manual, semi-automatic or fully automatic, with each type offering different advantages such as reduced labour costs, high quality, and increased speed of output. Some of ...

Ever since India embarked on its journey into semiconductor manufacturing, Outsourced Semiconductor Assembly and Test (OSAT) ...

SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to ...

Resonac has developed a temporary bonding film to support a wafer on a glass carrier in the semiconductor device fabrication ...

Advanced IC packaging is transforming the semiconductor industry, driving performance and efficiency amid the global chip ...

Kick-off series of the ITSI project in Ho Chi Minh City from Sept. 16-18 signify major steps forward in U.S.-Vietnam ...

TSMC, Micron, and ASE are working on deals to secure old display panel plants in Taiwan, and convert them to CoWoS advanced ...

PNN Mumbai Maharashtra [India] 19 RRP Electronics Ltd was pleased to announce the launch of Maharashtra first OSAT Outsourced ...

A semiconductor venture from the Zoho group could come up in Odisha with an investment of ₹3,034 crore. The company - ...

Test plays a critical role in a landscape impacted by legislation, technology development, and a shifting talent pool.

India’s large pool of highly educated workers is a strength, but the country must invest in developing specialised skills in ...

India should deepen its partnerships with countries like Taiwan and Japan to strengthen its presence in the semiconductor ...