A novel IO-ICP makes radar-SLAM more accurate than other sensor-based SLAM applications.

A new technical paper, “Device/circuit simulations of silicon spin qubits based on a gate-all-around transistor,” was ...

Whether caused by cosmic radiation, voltage glitches, or adversarial attacks, bit flips threaten data integrity, safety ...

Tighter restrictions on DUV litho; Arm-IBM dual-architecture deal; power device trio; Intel takes full control of Irish fab; ...

Researchers from Penn State University and University of Chemistry and Technology Prague propose using the 2D material ...

How integrating pre-silicon side-channel analysis into your standard verification process can reduce respins, support ...

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...

Key considerations for secure AI, along with limitations and recommendations to overcome the limitations for secure AI ...

A new technical paper, “3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment,” by the ...

Embedded World 2026 made one thing clear: AI is no longer confined to the cloud—it’s moving decisively onto the device.

Complex interactions challenge verification; dynamic voltage drop analysis; chiplet framework; automotive Ethernet.

If designers can verify individual blocks before subsystem integration, the verification team can focus on complex ...