A new technical paper titled “Directed self-assembly of block copolymers for high-precision patterning in the era of extreme ...

Researchers from Ulsan National Institute of Science and Technology (UNIST) built an ultra-small hybrid low-dropout regulator ...

The engineer decides to make a virtual twin (process model) of the etch process to mimic the actual behavior of the wafer ...

DRAM is becoming more complicated to develop, and more difficult to manage inside AI data centers. In the past, latency, ...

A new approach enhances AI understanding through hierarchical clustering techniques with LLM-driven keyphrase extraction.

The state of photomask revenues, EUV pellicles, and curvilinear masks.

What once was mainly associated with design exploration now spans the manufacturing lifecycle. In packaging and assembly, ...

AI and capacitive micromachined ultrasonic transducer chips are making diagnostics faster and more accessible.

Workloads, system performance, and the need to continually learn and adapt are demolishing constraints that have made chip ...

At the same time, all of this is being enabled by advancements in AI chips and algorithms, a virtuous cycle of smarter ...

The enormous computing demands of AI and high-performance computing (HPC) applications are putting intense pressure on every ...

Researchers focus on limiting data movement to reduce power and latency in edge devices. In popular media, “AI” usually means ...