A new technical paper titled “Channel-last gate-all-around nanosheet oxide semiconductor transistors” was published by ...
A new technical paper titled “Deep-learning atomistic semi-empirical pseudopotential model for nanomaterials” was published ...
A new technical paper titled “Hardware Acceleration for Neural Networks: A Comprehensive Survey” was published by researchers ...
Generative Golden Reference Hardware Fuzzing” was published by researchers at TU Darmstadt. Abstract “Modern hardware systems ...
What chip industry engineers were watching this year.
A new technical paper titled “Making Strong Error-Correcting Codes Work Effectively for HBM in AI Inference” was published by researchers at Rensselaer Polytechnic Institute, ScaleFlux and IBM T.J.
Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.
Designers are utilizing an array of programmable or configurable ICs to keep pace with rapidly changing technology and AI.
As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...
Thermal Modeling in Emerging Heterogeneous 2.5D/3D Systems (EPFL, Universidad Complutense de Madrid)
Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...
Ensuring that verification platforms can scale with industry demands and support new use cases as they emerge.
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