Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Designers are utilizing an array of programmable or configurable ICs to keep pace with rapidly changing technology and AI.

Researchers from the University of Southern California Information Sciences Institute and the University of Wisconsin-Madison ...

Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...

A new technical paper titled “LLM-based Behaviour Driven Development for Hardware Design” was published by researchers at ...

Ensuring that verification platforms can scale with industry demands and support new use cases as they emerge.

In today’s fast-paced electronics design automation (EDA) environment, effective data management has become essential.

Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.

An agentic AI-based approach to end-to-end bug resolution using both error logs and waveforms.

A new technical paper titled “Effects of Proton Radiation on Tin Oxide: Implications for Space Electronics” was published by ...

A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, ...